一种化学机械抛光液

Chemico-mechanical polishing liquid

Abstract

本发明公开了一种化学机械抛光液,其含有研磨颗粒和水,其还含有下述成分中的一种或多种:有机膦酸、聚羧酸类化合物、低级脂肪醇和糖类化合物。本发明的抛光液中,研磨颗粒的粒径随时间延长的增长率低。本发明的化学机械抛光液具有较高的稳定性、较长的存储时间和使用寿命。
The present invention discloses a chemical and mechanical polishing liquid, which comprises grinding particles and water. The polishing liquid also comprises one or more of the following components: organic phosphonic acid, polycarboxylic acid compounds, low-grade alkyl ethanol and carbohydrate. The growth rate of the particle size of the grinding particles along with the extension of time in thepolishing liquid is low. The chemical and mechanical polishing liquid has the advantages of higher stability and longer storing time and service life.

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Cited By (5)

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    CN-102911605-AFebruary 06, 2013安集微电子(上海)有限公司Chemical mechanical polishing solution
    CN-104513626-AApril 15, 2015深圳市力合材料有限公司, 清华大学, 深圳清华大学研究院Silicon chemical-mechanical polishing solution
    CN-104513626-BJanuary 11, 2017深圳市力合材料有限公司, 清华大学, 深圳清华大学研究院一种硅化学机械抛光液
    WO-2012051786-A1April 26, 2012安集微电子(上海)有限公司一种化学机械抛光液
    WO-2013020351-A1February 14, 2013安集微电子(上海)有限公司一种化学机械抛光液