IKENOUCHI TAKESHI (Total 16 Patents Found)

生体センサが設置位置からずれることによるセンシング結果の誤差を低減する。生物の所定部位に設置され生物の生体情報を検出する生体情報検出部により検出された生体情報を取得し、生体情報を検出したときの所定部位からの生体情...
본 발명은, 요구되는 반송경로 및 반송능력에 기초하여 행한 반송장치의 설계와, 그 설비의 능력검증 사이의 괴리를 없애고, 설계단계로부터 실가동단계로 원활하게 이행할 수 있도록 하고, 또한, 실가동단계의 장치의 운용변경, 장치대수 변...
<P>PROBLEM TO BE SOLVED: To provide a transfer path determination method of a transfer system to transfer a plurality of objects of transfer in a short time by selecting a shortest time transfer path from among a plurality of transfer paths available from a transfer start position to a target position. <P>...
<P>PROBLEM TO BE SOLVED: To provide a design support system of a carrying device, which eliminates deviance between a design of a carrying device performed on the basis of a requested carrying route and carrying performance, allows smooth transition from a design stage to an actual operation stage and is capable ...
A biological sensing system includes a biological information detector that is placed in a first specified portion of a living thing, and detects biological information of the living thing; a position displacement detector that detects an amount of a displacement of a position of the biological information detector fro...
The number of errors, caused by a displacement of a biological sensor from a placement position, of sensing results is reduced. Biological information detected by a biological information detection unit that is placed in a specified portion of a living thing and is configured to detect the biological information of the...
<P>PROBLEM TO BE SOLVED: To provide an automatic teaching method of a stacker crane capable of automatically setting appearing/disappearing height, lateral directional position and projection quantity of a transferring machine arm in each of shelf positions so that the transferring machine arm is projected at a c...
PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device providing excellent flatness after an insulating film buried between gate wirings is polished by a CMP method by using an optimum mask pattern. SOLUTION: The manufacturing method for the semiconductor device has a process in which ...